Indium to Showcase Offerings at IMAPS Device Packaging

(March 9, 2006) Clinton, NY &#8212 Indium Corp. of America will exhibit its wafer and chip bumping and semiconductor packaging materials offerings at IMAPS’ International Conference and Exhibition on Device Packaging (DPC 2006), to take place March 20–23, 2006, in Scottsdale, Arizona, at booth #35.


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