March 7, 2006 – Infineon Technologies AG has developed a computer memory module with an integrated thermal sensor using real-time temperature data to optimize system performance, targeting use in forthcoming mobile platforms from Intel.

The “thermal sensor on dual in-line memory module” (TS-on-DIMM), now available in sample quantities, is being demonstrated this week on a prototype Intel platform at the Intel Developer Forum. The technology reduces the operating speed of the system when temperature on a DIMM reaches a preset level, thereby decreasing power consumption.

Infineon says its DRAM chips based on trench architecture with comparable-density DIMMS run about 20% cooler than devices based on stack DRAM architecture, and that tests done in 2005 showed a 30% improvement in sustained memory bandwidth using Intel’s “Delta Temperature” in SPD technology, which is similar to Infineon’s TS-on-DIMM.

“Memory power is becoming increasingly important to overall system performance; TS on DIMM is a significant step toward achieving close-loop memory thermal management while optimizing platform performance,” said Keith Kressin, director of marketing, for Intel’s mobility group.

Small sample quantities of 1GB, 667MHz DDR2 SO-DIMM are available for US $150, with future devices including 2GB density TS-on-DIMM slated for release later this year.