March 8, 2006 – KLA-Tencor Corp., San Jose, CA, has unveiled its fifth-generation broadband UV/visible brightfield inspection system for capturing yield-impacting defects on critical layers.

The 2367, an extension of the company’s 23xx series and intended complement to its 2800 series full-spectrum DUV/UV/visible brightfield inspection platform, incorporates algorithms from the 2800, such as advanced binning and classification, enhanced edge contrast, and multidie auto threshold. Also, a new image computer and time delay integration sensor enable a 2x faster data transfer rate. It also shares a user interface and recipe commonality with other KLA-Tencor tools including the 2800, Puma 9000 darkfield inspector, and eS32 e-beam inspection tool.

Ute Vogler, module manager, contamination-free manufacturing at AMD’s Fab 36 in Dresden, Germany, said the company plans to integrate the 2367 for inspection of 300mm logic devices. “We require the sensitivity and speed of broadband illumination technology,” she stated.

To date, the 2367 is running in production at several 90nm and 65nm fabs worldwide; the installed base for the entire 23XX UV platform is running on more than 80 manufacturing lines worldwide.