March 28, 2006 – Privately held Canadian interconnect developer Microbonds Inc. has licensed its “X-Wire” gold wire bonding technology for use in Tanaka Denshi Kogyo’s line of gold bonding wire products, with an integrated product available by year’s end.

The X-wire interconnect uses a proprietary insulation applied to bare gold bonding wires, enabling interconnects to touch and cross without causing shorts, helping prevent yield losses due to wire sweep and develop new geometries.