Registration Closing for iNEMI Roadmap Workshop

Technology and infrastructure areas of focus within the Roadmap include:

(March 28, 2006) Shanghai, China &#8212 The SEZ Group is shipping multiple 2- and 4-chamber 300-mm Spin Processor systems to Amkor Technology as part of a follow-on order. The tools will be used for under-bump metallization (UBM) etch and photoresist strip for advanced packaging applications at Amkor subsidiary Unitive Semiconductor Taiwan (UST), as well as in their copy-exact line in Singapore.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.