C4NP Test Data Released

Preliminary C4NP manufacturing and reliability test results of both tin-lead and lead-free solders verify that there are no inherent failure mechanisms attributable to the C4NP process, according to a report presented by IBM and SUSS MicroTec at the IMAPS International Conference and Exhibition on Device Packaging, held March 21, 2006, in Scottsdale, AZ. The tests included six 200-mm wafers; three each bumped with lead-free SAC and SnCu alloys. Each 14.7-mm die held 2,452 4-mil bumps on 9-mil pitch, for a total of 284,432 bumps per wafer.


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