Elpida eyes 24% capacity ramp

April 26, 2006 – Elpida Memory Inc. plans to raise production capacity at its 300mm site in Hiroshima, Japan, by about 24% from current levels to 67,000 wafers/month by fiscal 1Q07, according to local media reports.

The company aims to more than double overall DRAM capacity in terms of storage amounts, at a cost of about 100 billion yen (about US $871 million). Elpida expects to have 70nm-based DRAM products ready by calendar 4Q06.

The company already announced it will more than double production capacity for DRAM chips used in cell phones to about 30,000 300mm wafers/month by year’s end, to tweak its product mix and lessen exposure to the PC market’s pricing and competitive pressures.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.