IC Packaging Market Hits $23.1B in ’05

By 2010, the worldwide semiconductor industry will ship 193 billion ICs, claims ETP, with an estimated value of $34.6 billion. This equates to a 10.6% compound annual growth rate (CAGR). Chip scale packages (CSPs) are expected to see the highest growth rates over this forecast period &#8212 CSPs include dual flat no-leads (DFNs), quad flat no-leads (QFNs), fine ball-grid arrays (FBGAs), die size ball-grid arrays (DSBGAs), and wafer-level packages (WLPs).

The full report offers in-depth analysis and forecasts, including an analysis of the contract IC packaging market, and unit, pricing, and revenue data. For more information, please visit www.electronictrendpubs.com.


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