Japan firm boosting packaging output

April 21, 2006 – Ibiden Co. plans to invest ¥8.5 billion (about US $72 million) to build a new semiconductor packaging facility in Ogaki, Gifu Prefecture, according to the Asia Pulse Businesswire.

The development and manufacturing site, on a 113,000 sq. m lot purchased earlier this year from textile manufacturer Toho Tenax Co. for $35 million, will be completed by January 2007, employing 600 people in R&D and production.

The company, which aims to tap demand for chip packaging used in PCs and mobile phones, has secured orders from customers including Intel. The company has other production facilities in Gifu Prefecture as well as The Philippines.


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