Keynote Explains 3-D Stacking

The main purpose of 3-D stacking of semiconductor die is not to save space &#8212 it is to save time. “To bring cells closer together by stacking them vertically, so that they are connected through only the thickness of the silicon,” explained Philip Garrou, Ph.D. of RTI International. “Die stacking is not bringing more integration into the IC, but disassembling it.” Garrou delivered the keynote address to a capacity audience at the IMAPS Advanced Packaging conference on March 22nd.

(April 5, 2006) Santa Clara, CA &#8212 Out of 12 recipients of the 2005 Intel’s prestigious Supplier Continuous Quality Improvement (SCQI) award, five are from the packaging industry.


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