April 4, 2006 – SUSS MicroTec announced that Microsystems Plaza (MiPlaza), a MEMS and nanotechnology research and development facility and service provider at the HighTech Campus in Eindhoven, the Netherlands, has selected SUSS MicroTec wafer bonding equipment for the manufacture of MEMS and and biomedical devices.

The two systems, consisting of a BA8 bond aligner and an SB8e wafer bonder, will support the aligned 8-inch wafer bond processes at the facility. MiPlaza, part of Philips Research, chose SUSS bonders over alternative systems for their precision bond alignment and high bonding uniformity for BCB applications with a layer thickness of 1 micron, according to a news release.

Substrate bonding represents the final step in the manufacturing process sequence in which multiple wafers or substrates are attached together using a number of physical and chemical effects. The SB8e is a semi-automatic, computer-controlled, stand-alone wafer bonder that can be used to design and fabricate novel microstructures.

The bonder can be equipped with tooling and alignment fixtures that support all known bonding processes. A wide array of semiconductor materials with wafer and substrate diameters ranging up to 200mm can be accommodated as well.