April 4, 2006 – Tokyo Electron Ltd. is offering a new wafer-level microelectromechanical system (MEMS) tester to help manufacturers isolate and validate electrical and mechanical functionality at the wafer level prior to packaging.
The company claims its Temeon tool lets customers test mechanical as well as electrical performance, and offers increased fault coverage to minimize package waste at the wafer level. A low-force contact methodology eliminates adverse effects to wafer yield due to strain applied to MEMS structures that may alter performance.
Details about the range of testing parameters or accuracy was not provided. An initial Temeon sample has been delivered to a Japanese MEMS device manufacturer.