April 5, 2006 – Tokyo Electron Ltd. announced it has delivered a new wafer level MEMS tester, the TEMEON, to a leading MEMS device manufacturer located in Japan.
The system enables manufacturers to stimulate a MEMS device and accurately isolate and validate the electrical and mechanical functionality at the wafer level prior to packaging.
The company says that with the TEMEON, customers can test the important mechanical structures of the MEMS device as well as the electrical performance. This capability offers the additional benefit of increased fault coverage, which minimizes package waste that previously would not have been captured at the wafer level.
In addition, the company says that the system offers optimization of the test setup and the testing process. The device uses a low force contact methodology at the wafer level to eliminate adverse effects to wafer yield due to strain applied to MEMS structures.