Toshiba merges ASSP, embedded SoC units

April 4, 2006 – Toshiba America Electronic Components Inc. has merged its ASSP and embedded processor SoC business units into a single operation. Shardul Kazi, formerly VP of the embedded SoC business, will be VP of the merged ASSP unit.

The new organizational structure will facilitate closer product synergy and synchronized ASSP engineering activities, he stated. Andrew Burt, previously a director in the ASSP business unit, will become VP of the company’s imaging and communications marketing group, which handles marketing activities for the company’s CMOS image sensor, CCD, wireless IC, RFIC, MPEG-4, automotive, analog and peripheral, and microcontroller product lines.


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