Unaxis unveils 45nm photomask tool

April 21, 2006 – Unaxis Wafer Processing, a leader in deposition and etch solutions, announced a fifth generation dry etch tool intended to allow advanced dry etch fabrication by addressing the biggest challenges faced by mask makers today.

The latest process innovations demonstrate sub-3nm CD uniformity in Cr etch and 2 degree phase uniformity for advanced Quartz mask – enabling the manufacture of 45nm photomasks.

The company says its Mask Etcher V tool provides enhanced ICP process solutions over previous systems, including improved particle control, ultra-low CD etch bias and sub-7nm feature-size linearity.


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