April ’06 Book-to-Bill Ratio Continues Climb

The 3-month average of worldwide bookings in April 2006 was $1.60 billion &#8212 almost 16% higher than the final March 2006 level of $1.39 billion, and over 60% higher than the $999 million in orders posted in April 2005.

(May 25, 2006) Munich, Germany &#8212 Freescale Semiconductor recently ordered one of SUSS MicroTec’s ABC200 automated production wafer-bonding systems. Silicon wafer bonding is a critical wafer-level packaging technology and an enabling technology for the mass production of cost-effective MEMS accelerometers for Freescale, so SUSS’ automated production wafer bonders ideally suit their needs.


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