Conference Targets 3-D Integration, Packaging

The conference brings industry leaders together to assess key enabling technologies, industry dynamics, and market applications driving 3-D integration and packaging, which continue to gain momentum in meeting performance, cost, and size demands for semiconductor devices and products. Attendees and speakers alike will learn the status of competing technology solutions, market trends and projections, design and manufacturing developments, and strategies to capturing market opportunities.

(May 16, 2006) Singapore &#8212 Advanced Interconnect Technologies (AIT) is adding more than 30,000 sq ft. to its Batam, Indonesia, assembly and test factory, bringing the total to 400,000 sq ft. The expansion is slated for completion by September 2006 and will dedicate to final test, which will allow them to meet growing demand for full turnkey assembly and test services.


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