FlipChip, Engent to make 3D packaging tech

May 26, 2006 – FlipChip International LLC and Engent Inc. are partnering to develop 3D wafer-level CSP (WLCSP) technologies, seen as a low-cost alternative to system-on-chip for highly integrated stacked die packaging applications.

The partnership will combine FlipChip’s ultrafine pitch wafer bumping capabilities and 2D wafer-level CSP package offerings with Engent’s advance surface mount and flip-chip assembly technologies. The platform to emerge from their efforts will support a range of ultrahigh volume IC packaging applications, including silicon-on-silicon, GaAs-on-silicon, and SiGe-on-silicon, as well as 3D integration of integrated passive device technologies and MEMS devices for system-in-a-stack offerings.

“We are excited about our alliance with Engent since it enables our customers to realize the cost and miniaturization benefits of 3D stacking over traditional 2D packaging,” stated Bob Forcier, CEO of FlipChip International.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.