FlipChip International and Engent Form Strategic Alliance

The partnership is intended to couple FCI’s high-volume, ultra-fine-pitch wafer bumping capabilities and 2-D wafer-level package portfolio with Engent’s flip chip assembly and surface mount technologies. The outcome is expected to be a flexible technology platform that will support a range of high-volume, IC package applications, 3-D integration of emerging integrated passive device technologies, and MEMS devices.

(May 31, 2006) San Jose, CA &#8212 This year’s SEMICON West 2006, to take place July 10–14 at the Moscone Center in San Francisco, CA, will feature many keynote presentations, as well as a selection of short courses sponsored by IEEE/CPMT, Pinnacle Training International (PTI), SEMI, the International Society for Optical Engineering (SPIE), and the Standards Technology Group (STG). Scheduled keynote speakers are executives hailing from STMicroelectronics, Micron, Mentor Graphics, Xilinx, LogicVision, and Surfect Technologies. A series of Standards Technical Education Program (STEP) courses round out the program.


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