Freescale orders production wafer bonding system from SUSS MicroTec

May 24, 2006 – SUSS MicroTec announced it received an order for a production wafer bonding system from Freescale Semiconductor (NYSE:FSL)(NYSE:FSL.B). Freescale calls silicon wafer bonding is a key enabling technology for the mass production of cost effective MEMS accelerometers.

SUSS MicroTec is a precision manufacturing and test equipment supplier for the semiconductor and emerging markets. Freescale Semiconductor designs and manufactures embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets.


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