May 26, 2006 – Member companies of the International SEMATECH Manufacturing Initiative (ISMI) have reached consensus on key concepts of the group’s proposed “300m Prime” (300′) program, proposed as a productivity improvement roadmap for 300mm semiconductor manufacturing processes and equipment, and provide an eventual bridge to 450mm technologies and equipment.

Among the key concepts in the 300′ Prime program:
– Productivity enhancements must be scaleable to 450mm with minimal changes in design and architecture, be tested and proven within a 300mm setting, and demonstrate an acceptable return on investment;
– Multiple-use manufacturing models need to be addressed, including high- and low-volume product mixes, and multiple flexible lot sizes operating within acceptable cycle times; and
– Evolutionary process developments — i.e., some current 300mm productivity improvements will be coordinated and deployed in 300′ or 450mm fabs.

Those guiding principles will become “the foundation for gathering specifics on productivity designs, attributes, and metrics to be pursued in today’s 300mm fabs, which will help pave the way to 450mm implementations,” stated Scott Kramer, ISMI director.

The 300′ strategy draws on lessons learned from the conversion from 200mm to 300mm, with an emphasis on collaboration, consensus-building, and compromise among chipmakers and equipment suppliers, added Joe Draina, ISMI associate director.