SPIL Picks SUSS Lithography Systems to Boost Solder Bumping

“SUSS MicroTec systems provide us with the capabilities needed to supply the latest design in solder bumping processes, especially in wafer-level chip scale packaging (WLCSP) and re-distribution layer (RDL), to the industry, which is driven by improved chip performance, package form factor, and lower cost”, comments Johnson Tai, VP of Manufacturing, 3rd Division, SPIL.

(May 10, 2006) Stratham, NH &#8212 Three lead-free RoHS seminars co-hosted by Stratham, NH-based Vitronics Soltec and Des Plaines, IL-based Kester will take place in June, and will be held in three different locations across the U.S. Each one-day seminar aims to help the North American electronics manufacturing industry get answers to lead-free assembly questions, as well as ease the transition to lead-free and RoHS.


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