Underfill Epoxy

123-38A/B-187 thermally conductive underfill epoxy is designed specifically for flip chip assembly. It is a nitride-filled, 2-component compound designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface. The material is said to strengthen chip packages, protecting from moisture while adding mechanical strength. Creative Materials Inc., Tyngsboro, MA, www.creativematerials.com.


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