Gyroscopic Chip Enters Mobile Market

Multi-axis gyroscopes help an inertial measurement unit (IMU) platform measure absolute rotation in free space. The dual-axis gyroscope die, with integrated X- and Y-axis, measures 3.5mm &#215 3.5mm &#215 1mm and is combined with a three-axis accelerometer. InvenSense claims that packaged together, they create a tiny, integrated, five-axis motion sensor. This configuration, combined with an external Z-axis gyroscope, features 5000-g shock tolerance, high cross-axis isolation with low cross-axis sensitivity, vibration rejection over a wide frequency range, and 3V single supply operation with low offset voltage.

(June 27, 2006) ATLANTA, GA and ARMONK, NY &#151 IBM and the Georgia Institute of Technology announced production of a prototype chip that breaks the 500 GHz operating frequency record. Research was supported by IBM, NASA, and the Georgia Electronic Design Center (GEDC), where it was carried out on a specialized high-frequency test system. The research team used a liquid helium cooling process to cryogenically freeze the circuit to -451&#176F &#151 8&#176F above absolute zero.


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