PulseCore will offer ICs to leading OEMs as solutions for electromagnetic interference (EMI) reductions, clocking, power management, and systems monitoring requirements. Their solutions reportedly reach over 75 million end-products in a global market.
(June 19, 2006) HUDSON, NH — CeTaQ Americas expanded its machine performance verification services to include placement verification testing for 01005-size passive chip components.
Components at this size require pad dimensions and geometrics to be measured in microns. Accurate and repeatable placement is difficult, requiring placement equipment that operates within tight performance tolerances to minimize defects. “There is a large demand for assessing the capabilities of machines that place these chips,” said Mike Sivigny, general manager, CeTaQ. He added that the small components are responsible for high defect levels and are poor candidates for manual rework due to their size. He finds that systematic offsets per head, per nozzle, per angle, or generally, are prevalent problems with chip shooters.