Laser Dicing Systems

The IX-200 ChromaDice DPSS version is a high-precision wafer dicing system suitable for wafer trimming and scribing applications. Its UV diode-pumped solid-state (DPSS) laser system is said to deliver high-speed wafer dicing and cutting with typical yields above 99%. The process tolerates wafer warp and bow, and the system is available in an excimer laser version for via drilling, micromachining, thin film patterning, and other semiconductor packaging applications. The IX-200 ChromaAblate system &#8212 suitable for micromachining of III-V materials as well as polymers and ceramics &#8212 is an excimer laser configuration. J. P. Sercel Associates, Hollis, NH,


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