SMIC, Chinese investment firm building 300mm fab

June 28, 2006 – An investment company associated with the Hubei provincial government has broken ground on a new 300mm chipmaking facility, with Semiconductor Manufacturing International Corp. set to manage, but not own, the plant.

Construction of the fab in the Wuhan East Lake New Technology Development Zone is scheduled to be completed by the end of next year, with initial production beginning in 1H08 with 12,500 wafers/month, ramping to 20,000-25,000 wafers/month by 2009.

Financial details were not disclosed (costs for building and equipping a leading-edge 300mm fab typically exceed $3.0 billion), but financing will come from Wuhan Xinxin Semiconductor Manufacturing Corp., while SMIC will manage the facility.

SMIC already has one 300mm fab in Beijing and reportedly wants to build another one in Shanghai, in addition to its four 200mm fabs in Shanghai and Tianjin.


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