Soitec adds CEA-Leti spinoff’s thin-film layer transfer tech

June 8, 2006 – Soitec, Bernin, France, has acquired CEA-Leti spinoff TraciT Technologies, a developer of thin-film layer transfer technologies for MEMS and power circuits, for an undisclosed amount.

The Grenoble-based company, formed in 2003, specializes in thin-film layer transfer technologies that utilize molecular adhesion and mechanical, as well as chemical thinning processes for the production of microelectromechanical systems (MEMS) and power circuits. The deal expands Soitec’s IP portfolio, and gives it access to new markets through fully process circuit transfer technology, such as wafer-level packaging.

Andre-Jacques Auberton-Herve, president and CEO of the Soitec Group, pointed to the “proximity and complementary nature of TraciT Technologies’ activities on advanced materials, and the similarity of our corporate cultures.”

The companies’ joint research efforts on complementary SOI segments “should allow us to achieve breakthroughs relevant to the entire semiconductor industry,” added TraciT founder and chairman Bernard Aspar.


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