Tegal announces Endeavor order from packaging company

June 16, 2006 – Tegal Corp. announced that a global leader in wafer level packaging technology has placed an order for an Endeavor AT PVD cluster tool for under-bump metallization with Sputtered Films Inc., Tegal’s wholly-owned subsidiary.

The re-certified Endeavor system, the fifth such tool to be purchased by this customer, will be used for merchant wafer level packaging services provided out of their U.S.-based facility.

The Endeavor AT PVD tool is a five-module cluster tool which deposits films with low to zero stress values on wafer sizes of 3 inches to 8 inches. Endeavor systems are used in manufacturing advanced power devices, photo masks (including EUV), light emitting diodes (LED), and backside metallization of ultra-thin wafers and advanced wafer level packaging applications.


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