Tessera Outlines Agenda for U.S. Technology Symposium

(June 9, 2006) SAN JOSE, CA &#151 A comprehensive discussion of the semiconductor supply chain will be presented at the U.S. Technology Symposium on July 10th, with industry experts from Motorola, Hewlett-Packard, Intel, Samsung, Cadence, Prismark Partners, and Tessera speaking. The symposium &#151 taking place the day before SEMICON West opens &#151 is structured to offer a broad view of the technologies and trends driving the future of electronics miniaturization and performance.

(June 9, 2006) TAIPEI, Taiwan &#151 Akustica announced a joint venture with Ricoh Company, Ltd., to develop a camera module solution using AKU2001, a digital output microphone chip. The companies expect the collaboration to speed time-to-market production on video and voice over internet protocol (VVoIP). The camera module will be used for universal serial bus (USB) audio/video (A/V) applications. James Rock, president and CEO of Akustica, cited real-time-communications programs as the impetus for developing chips with VVoIP applications.


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