This Week in Packaging

Intel is opening a design and development center in Malaysia, in close proximity to its assembly and test function facility. The center focuses on chip and board design, which allows for synergy with the nearby packaging facility. SanDisk will be opening a packaging and test facility in Shanghai by the end of this year. You don’t hear much about SanDisk’s packaging capability, but given SanDisk’s success in recent years, they must be doing something right.

(June 21, 2006) SAN JOSE, CA &#151 For more than 20 years, Positio Public Relations has hosted an annual event for media, analysts, and senior industry executives at SEMICON West. This year’s theme&#151SanFranVegas, Baby!&#151combines Las Vegas glitz with San Francisco chic. The invitation-only event is for senior management of approved clients and guests and accredited media and analysts. CFOs, CEOs, and editors are expected to attend. It will take place Tuesday, July 11, 7-11 pm) at the Four Seasons Hotel in downtown San Francisco, two blocks from the Moscone Center.


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