Toshiba building $450M 200mm fab for power chips

June 1, 2006 – Showing it’s not entirely focused on its huge flash memory JV investments, Toshiba Corp. said it will build a new 200mm fab in northern Japan to make power semiconductors, in answer to demand for devices incorporated in consumer electronics such as flat-panel TVs, mobile phones, notebook PCs, and gaming consoles.

The company will spend about 50 billion yen (roughly $445 million) over five years at the 200mm site in Ishikawa Prefecture, run by subsidiary Kaga Toshiba Electronics Corp., with construction starting this September and mass production slated for 3Q07, Full capacity of 60,000 wafers/month is projected by the end of 2010.

Some production equipment will be transferred from Toshiba’s Yokkaichi operations and other facilities, as well as equipment purchases from outside the group.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.