June 30, 2006 – Toshiba Corp. has licensed certain stacking technologies for NAND flash memory leaded packages, the two firms stated. Financial details of the two-year deal or the specific technologies licensed were not disclosed.
The company’s portfolio includes thin small outline package (TSOP) and chip scale package (CSP) chip-stacking technologies, as well as its ArctiCore module technology addressing thermal, mechanical, and electrical performance in enterprise and consumer electronics. Last November Staktek released FlashStak, a family of flash memory stacking technologies initially targeting 0.5mm pitch TSOP components.
For Staktek, which claims more than 185 million DRAM stacks have been shipped using its technologies, “it was a natural progression for us to expand into the fast-growing Flash memory market,” stated Wayne Lieberman, president and CEO.