ATMI unveils new copper electrochemical deposition process

July 10, 2006 – ATMI Inc., Danbury, CT, and Enthone Inc., a division of Cookson Group PLC, have introduced a new copper electrochemical deposition process for 45nm process technologies and below, developed for Novellus Systems Inc.’s Sabre tool. The two firms originally signed a deal two years ago for ATMI to market and sell the core Viaform technology.

The companies said the new Viaform Extreme chemistry and process has been validated at unnamed leading semiconductor manufacturers for creating copper films “of high reliability.”


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