BGA Adapter

The Correct-A-Chip ball grid array (BGA) adapter enables an operator to mount a 0.8-mm pitch device to a PCB assembled for 1.0-mm-pitch devices. The bottom of the adapter mounts to a PCB with a BGA pad footprint of 1.0-mm pitch, while the top accepts BGA devices with 0.8-mm pitch. The 16 &#215 16 array (256) BGA adapter from Aries Electronics measures 0.650 in2. Its construction consists of a 0.040 FR-4 material with 0.020 ” diameter tin/lead (63/37%) solder balls. The immersion gold over electroless nickel (ENIG) PCB plating is composed of 3 &#150 8 &#181″ gold (per IPC-4552) over 100 &#181″ minimum nickel (per ASTM0B-733). The adapter’s solder mask is black liquid photo imagable (LPI). It operates at a continuous 221&#176F. Custom options are available. Aries Electronics, Frenchtown, NJ,


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.