July 5, 2006 – Cabot Microelectronics Corp., Aurora, IL, has agreed to acquire a number of patents from IBM Corp. relating to CMP slurry technology, for various applications including copper, copper barrier, tungsten, and dielectrics. Terms of the deal were not disclosed.

“We believe these technology rights will enhance our competitive advantage and expand our already substantial intellectual property portfolio,” stated William Noglows, Cabot chairman and CEO, noting that Cabot and IBM have collaborated “for almost twenty years, since the early days of CMP technology.”