Cookson, Microbonds combine insulated wire bonding, mold compounds

July 6, 2006 – Cookson Electronics Semiconductor Products and Microbonds Inc. have formed a codevelopment project to combine Microbonds’ X-Wire insulated wire bonding technology with Cookson’s Plaskon family of mold compounds.

“The ongoing need to cost effectively mold ever smaller package sizes and types, while maintaining or increasing electrical and yield performance, is beginning to push the limits of molding bare bonding wires,” stated Scott Craig, SVP and GM of the Cookson division.

“The integration of X-Wire Technology with the Plaskon leading molding compounds will provide customers new flexibility in the development and assembly of high performance-to-cost packaged ICs,” added Microbonds CEO John Scott.

Microbonds’ X-Wire Technology insulates gold and copper bonding wires used to connect the silicon die with the package device, addressing limitations of bare bonding wires which short out the device when they touch. Target applications include incorporating thinner diameter gold wires, longer wires, stacked die for wireless applications, and other 3D packaging requirements.


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