EV, Brewer system targets ultrathin wafer handling

July 19, 2006 – Austria’s EV Group and US-based Brewer Science Inc. say they are codeveloping a temporary wafer-bonding system for handling ultrathin wafers, designed to allow high-temperature advanced packaging processes followed by quick debonding. The combined technology, built on the EVG 850 temporary bonding platform used for low-temperature post-processing applications in the compound semiconductor and power device markets, is already being evaluated by customers, the firms said.

The collaboration is one more step toward providing a complete technology package to customers, instead of individualized product offerings, according to Erich Thallner, CEO and founder of EV Group. “It is no longer possible to only supply the equipment or the material. It is up to organizations like Brewer Science and EVG to work together to tackle the industry challenges and to provide the full solution to our customers, so that we may all be successful.”


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