EV Group and Brewer Science Seek Handling Solution

(July 21, 2006) ROLLA, MS and ST. FLORIAN, Austria &#151 EV Group, which specializes in wafer bond systems, and Brewer Science Inc., a multidivisional technology company, are co-developing a solution for handling ultra-thin wafers. EV Group and Brewer Science’s research for high-temperature advanced packaging processes involves temporary wafer bonding for the ultra-thin wafers.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.