EV Group, Brewer collaborate on ultrathin wafer solution

July 20, 2006 – EV Group (EVG), based in St. Florian/Inn, Austria, and Brewer Science, based in Rolla, Mo., announced that they are co-developing a solution for the handling of ultrathin wafers that will allow high-temperature advanced packaging processes using a temporary wafer bonding system.

EVG’s EVG850 Temporary Bonding platform is already used extensively in low-temperature post-processing applications in the compound semiconductor and power device markets. The company says the extension of the product line into tackling one of the mainline semiconductor industry’s technical hurdles is a natural progression for the system.


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