FocalSpot Re-enters Packaging Test

(July 18, 2006) SAN FRANCISCO &#151 FocalSpot, an inspection and rework company for ball grid arrays (BGAs) and SMT, announced they will re-enter the semiconductor and microelectronics industry with a product rollout targeting packaging test. Their package design verification solution will be a high-magnification x-ray and image processor combination that will inspect and measure internal package electrical connections, as well as intra-package prototype characteristics.


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