Advanced Packaging Award Winners Lauded

The complete list of award recipients, by category, is as follows:

(July 14, 2006) TEMPE, AZ &#151 Focusing on complex ceramic products, CMC Interconnect Technologies further expanded its ceramic substrate, module, and package-rework capabilities. The reworked substrates meet the quality standards and product-reliability specifications that apply to new substrates. Customers often are unaware of the rework option, notes Nick Leonardi, vice president of marketing at CMC.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.