July 27, 2006 – ICOS Vision Systems Corp. NV and European R&D center IMEC have agreed to collaborate on development of metrology methods targeting 3D packaging processes for ICs, including wafer-level packaging, flip-chip, systems-in-package, and microelectromechanical systems (MEMS).
The two-year Joint Exploration and Development Program will be closely linked to IMEC’s industrial affiliation program on 3D stacked ICs, which spans work with many leading industry IC suppliers. Research will be conducted at IMEC labs, with ICOS providing inspection and metrology technology and equipment.
“Packaging is becoming an increasingly important part of semiconductor manufacturing and we are expanding our research efforts in the packaging field, including a large research program on 3D packaging,” said Gilbert Declerck, CEO of IMEC. “We are delighted to work with ICOS on the advancements of the 3D packaging processes and the metrology tools that are needed.”