The lead-free alloy market continues to be competitive, said Gerry Campbell, global product manager at Cookson. “We will continue to work closely with LG through Alpha Korea,” he added.
(July 13, 2006) SAN FRANCISCO — Advanced Packaging Magazine announced its Sixth Annual Advanced Packaging Awards recipients during a presentation at the San Francisco Museum of Modern Art on July 12, 2006. The nominees gathered at the Wattis Theater to accept awards and mingle at a reception that followed.