Micralyne buys Suss bonder and aligner

July 7, 2006 – Micralyne Inc., an Edmonton, Alberta, manufacturer of MEMS components, announced it has purchased the SB6e wafer bonder and BA6 aligner system from SUSS MicroTec Inc., a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets.

Micralyne said that due to increasing production demands over the past year, it has doubled its employee base and added additional working shifts at its 50,000 sq. ft. plant. As part of this ramp up to volume production the company is investing in facility expansion and capital equipment, such as adding aligned wafer bonding capacity.

The SB6e is a semi-automatic, computer controlled, stand-alone substrate bonder. Featuring a rigid vacuum/pressure chamber, upper and lower independent heaters & wafer stack loading arm, the SB6e represents the latest generation of SUSS substrate bonders. Combined with the BA6 SUSS Bond aligner the SB6e provides superior post bond alignment, force and temperature uniformity, and pressure control capabilities for wafer level packaging of MEMS.

The company recently announced record financial results for the fiscal year ending March 31, 2006. Revenues for the year reached $15.6 million, an increase of 53 percent over the previous year. The company said net income also increased over ten-fold from the 2004-05 total to 2005-06. Micralyne also announced that several new companies were added to the customer roster while a number of existing customers significantly increased their production orders.


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