Due to the purchase, volume production expansions and a new production aspect &#151 aligned wafer-bonding &#151 will occur. SUSS recognizes an industry movement among MEMS foundries. They are a growing market segment for us, said Michael Kipp, president, wafer bonding division, SUSS.

(July 11, 2006) PITTSBURG &#151 Ansoft Corporation announced that their circuit-simulation software for high-performance IC design &#151 Nexxim &#151 was accepted into the Cadence Design Systems, Inc., Connections Program. Cadence’s Virtuoso Analog Design Environment already integrates other Ansoft software, including their Q3-D Extractor and TPA package analysis tools. “Ansoft specializes in analysis software, and Cadence does design software. Our programs are complementary, not competing,” said Mark Ravenstahl, director of marketing communications, Ansoft. He added that while some Cadence and Ansoft electronic design automation (EDA) programs “overlap,” collaborations involving tool-integration generally create connections that reach engineers at more stages in the design process than would be feasible with separate programs.