Olympus system inspects wafer top, back, edge and bevel

Model AL3300 is high throughput system with small footprint; SEMICON West 2006 — Booth #234

July 7, 2006 — /BUSINESS WIRE/ — SAN JOSE, Calif. — Olympus Integrated Technologies America (Olympus-ITA), a subsidiary of Olympus Corporation of Japan, introduces the Model AL3300 optical inspection and defect review system for full top, edge, bevel and back side inspection of 300 millimeter wafers. The bevel inspection uses a continuous angle adjustment for best imaging and defect detection. It provides a throughput up to 180 wafers per hour in a small, flexible configuration footprint that can be configured to match any factory floor layout. Macro observation can be done under various illumination wavelengths to see macro defects such as contaminations, scratches, resist problems, film thickness variations, etc. A macro camera can automatically capture 1X images of the wafer.

Olympus’ AL3300 system performs a broad range of inspection and defect review tasks, including macro observation of wafer front and back sides, micro inspection, edge inspection, full bevel inspection including 3.5mm of the top and backside edge, automated image capture, defect review and wafer sorting. These tasks help the user identify and eliminate defect sources, maximizing yields. The systems include a variety of visible light imaging methods using Olympus Universal Infinity Systems’ (UIS) infinity corrected optics for superior imaging and resolution. The system can also integrate Olympus’ 248nm patented Deep-UV Air Gap optics to increase the optical resolution to 80nm.

Macro inspection includes both front side and back side (back center and edge) in a single wafer pass. Micro inspection allows the operator to view the wafer under a range of magnifications and imaging techniques that include bright field, dark field, Nomarski (DIC), confocal, and high resolution DUV and DUV confocal. Defect review can be added to the systems in a manual mode where the operator classifies in-line or off-line using a fast and convenient image gallery. Defects are imaged, stored and classified, the defect data is stored in a common format and can be uploaded to the user’s yield management database.

The AL3300 is fully GEM300 compliant for seamless integration into the user’s automated factory. The load ports (FOUP or FOSB) are available in rear or front load configurations.

About Olympus-Integrated Technologies of America

Olympus Integrated Technologies America, Inc. (Olympus-ITA) was founded in March 2000 as a wholly owned subsidiary of Olympus Corporation, Tokyo, Japan. Specializing in semiconductor products and systems for wafer inspection and defect review, Olympus-ITA is the application software development R&D center for Olympus semiconductor products. Its location in San Jose, Calif., enables the company to respond quickly to provide sales, service and support to semiconductor companies throughout the United States. For more information, contact Greg Baker at 408-514-3918, email [email protected] or visit our website at www.olympus-ita.com.

Olympus Integrated Technologies America, Inc.
Greg Baker, 408-514-3918
Fax: 408-946-3841
[email protected]
A-R Marketing, Inc.
Andrea Roberts, 858-451-8666
Fax: 858-683-2083
[email protected]


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