Structural Desiccants
Designed to protect semiconductors in sealed environments that are vulnerable to moisture ingress through packaging material, NatraSorb 900 and Multiform desiccants remove water vapor and provide crush-resistance at up to 8,000 lb per in2. Multisorb produces the desiccants in pre-molded shapes or blanks for custom fabrication, to be integrated into semiconductor or packaging design. Designers can incorporate the desiccants into development phases of production, instead of adding them at shipping or storage.
The TF series of fluxes conform to the majority of lead-free processes and offer compatibility with various underfill materials. Designed for chip- and ball-attach, Heraeus’ fluxes come in no-clean, solvent-clean, and water-soluble versions. The company states that the fluxes offer higher yields through their print and dispense capabilities.