SUSS MicroTec develops wafer bonder for high vacuum apps

July 20, 2006 – SUSS MicroTec, a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, showed for the first time a unique wafer bonding system designed for high vacuum applications. The company says it will be available in the third quarter of 2006.

The field-upgradeable load locked wafer bonding system was developed by SUSS MicroTec for advanced MEMS devices that require ultra clean, low moisture and low contamination vacuum bonding.

Named “M-Lock,” the new product offering is well suited for MEMS devices with on-chip getters such as silicon gyros and other advanced MEMS products, according to the company. The M-Lock system furthers the state-of-the-art process technology for wafer bonded MEMS sensors and devices that require on-chip high vacuum or an ultra-clean wafer bonding environment for high performance and high reliability products. This is achieved by maintaining high vacuum with a secondary load lock chamber and by heating the vacuum chamber walls to reduce the effect of outgassing during wafer bonding.


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