Dongbu, Cadence develop design kit for high-voltage chips

August 9, 2006 – South Korean specialty foundry Dongbu Electronics and Cadence Design Systems Inc. have developed a high-voltage BCDMOS (bipolar, CMOS, DMOS) process design kit for processing 60V chip designs using 0.35-micron process technologies. The chips are being produced for use in high-voltage and power-management applications in automobiles, computer peripherals, and communications products.

The new high-voltage BCDMOS version contains simulation, layout, and verification structures needed to streamline chip design, and is wholly optimized for Dongbu’s wafer fab processing equipment and flows. Work has already begun on processes to implement 85V BCDMOS and 5V analog semiconductor functions, noted Jae Song, EVP of marketing for Dongbu.

Dongbu aims to fill a niche by manufacturing high-voltage BCDMOS chips within Korea, a market where most companies import high-voltage semiconductors to manufacture their products. “Providing PDKs for specialty processes such as high-voltage BCDMOS is but one indication of our ongoing commitment to reach this goal,” stated Song. Dongbu and Cadence started partnering two years ago kits for analog functions in CMOS mixed-signal chips.


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